Key Insights (AI-assisted): By pushing battery-free sensing into dual-band, longer-range operation at lower unit cost, this move signals that ambient IoT is shifting
Key Insights (AI-assisted): This launch signals how 5G modules are evolving from pure connectivity components into integrated compute-and-connect platforms. Support for 24 TOPS,
Key Insights (AI-assisted): HaLowLink 2’s general availability signals that Wi-Fi HaLow is moving from chipset sampling to deployable infrastructure for real-world IoT networks.
Key Insights (AI-assisted): By tightly coupling connectivity hardware with an AI-centric industrial platform, this partnership accelerates convergence between operational technology and advanced edge
Key Insights (AI-assisted): Nordic’s move effectively collapses the stack between ultra‑low‑power connectivity silicon, ML tooling, and lifecycle cloud services. By embedding an NPU and
Key Insights (AI-assisted): By tightly coupling NXP’s i.MX 9 compute with Wi‑Fi 6 and multi-protocol radios in an entry-level form factor, Quectel is
Key Insights (AI-assisted): Sony’s positioning of eRedCap as the anchor for long-life 5G IoT signals that mid-tier cellular performance is becoming strategically more
Key Insights (AI-assisted): This move signals a convergence between secure-by-design IoT software stacks and US-based semiconductor manufacturing for mass-market smart home deployments. By
Key Insights (AI-assisted): By pairing a 3nm application processor with a smart module form factor, Quectel is pushing smartphone-class compute and graphics deeper
By Manuel Nau, Editorial Director at IoT Business News. By 2026, eSIM in IoT is no longer “new”—it’s the default expectation in many
